Electronic Slurry Filter Cartridge

Without CMP(chemical mechanical planarization),advanced multi interconnect level semiconductor devices would not be possible.

CMP slurries work chemically and mechanically on special tools (polishers) to smooth wafer surfaces. Well designed filters remove unwanted large hard particles and agglomerates in CMP slurries that can land on and scratch the wafer surface, while allowing engineered working particles in the slurry to pass through the filter.

Increasing semiconductor process challenges rely on water, chemicals, solvents, and gases which are free of yield killing submicron or nanometer size particles, as well as metal, ionic, and organic contaminants which can be leached from wetted materials.

Filtration of these fluids is a critical requirement in semiconductor and other microelectronics processes.

Filters and purification devices must remove the particles from upstream particle sources while not contributing other unwanted contaminants.

The unique net cover structure prevents the fiber of the filter element from falling off.

The gradient design from the outside to the inside avoids the surface clogging of the filter membrane by the condensed slurry too quickly, makes full use of the dirt holding space, and has high dirt holding capacity and longer service life.

All polypropylene material structure, using thermal welding technology, no adhesives, very little leaching, effectively controlling the precipitation of leaching.

The unique winding design can achieve precise filtration of CMP slurry. Efficiently intercept large particles and release effective particles.