عنصر المرشح الضوئي
Photoresist filtration is defect control, and the defect that matters is smaller than the feature being printed. That sets the grade, and it is why this element starts at 20 nm rather than at a micron figure.
Everything else is set by the chemistry. Resist and the fluids around it — developers, edge bead removers, thinners — attack most of the materials a filter is conventionally built from. The PRFN uses Nylon 66, which holds retention at nanometre grades while standing up to the solvents involved, on a standard 2.7″ (69 mm) body in 10″ to 40″ lengths.
- تصنيف الميكرون
- 20 nm – 10 µm
- معدل التدفق
- 1–5 GPM per 10"
- درجة الحرارة القصوى
- 70°C
- SKU
- PRFN
- Grades from 20 nm — sub-100 nm defect control
- Nylon 66 media — retention and solvent resistance in one construction
- Three seal materials including F-FKM perfluoroelastomer
- Standard fitment — 2.7" body, DOE and SOE end caps
- Four lengths — 10" through 40"
- SEM and ICP-MS records available on request
| السلسلة | PRFN |
| وسائط الترشيح | Nylon 66 |
| Micron rating | 20 nm · 40 nm · 0.1 · 0.22 · 1 · 3 · 5 · 10 µm |
| Outer diameter | 2.7" (69 mm) |
| Length options | 10" · 20" · 30" · 40" |
| الغطاء النهائي | DOE · SOE (226 fin, 226 flat, 222 fin, 222 flat) |
| O-ring / gasket | EPDM · FEP · F-FKM |
| Flow rate | 1–5 GPM per 10" element (suggested) |
| Max. differential pressure | 4 bar at 21 °C · 2.4 bar at 70 °C |
| Max. temperature | 70 °C |
| الشهادات | آيزو 9001 |
| Minimum order | 5 pieces |
| Lead time | 15 working days |
- Photoresist: defect control ahead of the coater.
- Developer and EBR: aqueous and solvent lithography chemistry.
- Thinners and solvents: F-FKM sealed construction.
- High-purity process fluids: where extractables are controlled as tightly as particles.
This is the specification most often got wrong on lithography duty. An element rated for a fluid, behind a seal that is not, fails at the seal — and it fails as contamination rather than as a leak, which means it is found on the wafer rather than on the floor.
| ختم | Specify for |
|---|---|
| EPDM | Aqueous developer chemistry. |
| FEP | Encapsulated. Fluids that would attack an exposed elastomer. |
| F-FKM | Perfluoroelastomer. The most aggressive solvent duty, and the usual choice where extractables are controlled as tightly as particles. |
Compatibility depends on the specific fluid, its concentration and its working temperature, not on the material name. Send those three with the enquiry.
Eight grades: 20 nm, 40 nm, 0.1, 0.22, 1, 3, 5 and 10 µm.
The nanometre grades are for resist itself and for the final filtration point closest to the coater. The micron grades serve bulk delivery, drum transfer and recirculation loops, where the job is protecting the fine stage rather than protecting the wafer.
Filtering finer than the process requires is not free on a resist line. Resist is a formulated fluid, and an over-tight grade removes formulation along with contamination.
Every element is tested in Pullner’s own laboratory from incoming raw material to finished goods. The bench includes a PMI pore size analyser, an SEM resolving to 3 nm, ICP-MS, an ion chromatograph and an IFTS single-pass rig.
On lithography duty the SEM and ICP-MS records are the ones asked for first, and they are available per batch on request. Request them alongside the sample rather than after — on a fab qualification that ordering usually saves a full cycle.
Up to two samples ship worldwide free of charge, with freight paid by the customer.